Advanced chips are increasingly limited by heat trapped inside their wiring layers. The insulating films between interconnects must have a low dielectric constant (so signals stay fast and clean) but almost every good insulator is also a terrible heat conductor. A material with SiO₂-like ε and metal-like κ — depositable below 400 °C so it survives back-end-of-line (BEOL) processing — would be transformative, and decades of materials engineering have barely moved the frontier.
Material Discovery Bench asks whether frontier language models can move it. Each model is dropped into an agentic harness with real research tools and asked to propose novel crystalline materials — high κ, low ε∞, dynamically stable, BEOL-compatible — that don't exist in today's materials databases.
Both objectives are mapped to a "larger is better" axis normalized to a
champion anchor: thermal t = κ / κ(diamond)
with κ(diamond) = 2200 W/m·K, and dielectric
d = ε∞(SiO₂) / ε∞ with
ε∞(SiO₂) = 2.4. The ideal corner (1, 1) is a material
with diamond's conductivity and SiO₂'s dielectric constant — no known
material comes close. A single candidate scores
t·d ∝ κ/ε∞, the familiar figure of merit; a whole
run is scored by the set hypervolume its own Pareto staircase
claims, so dominated near-duplicates add nothing and spreading along the
frontier pays.
We label provenance everywhere. Prescreen values come from PET-MAD MLIP screening (fast, approximate); ground truth comes from asynchronous DFT verification jobs. Synthesis recipes are reviewed by an offline grader panel — and, for a handful of top candidates, by actually attempting them in a cleanroom. Numbers on this site marked "MLIP prescreen" should be read as advisory, not established.
The harness is open source and model-agnostic — every model runs the identical configuration, prompts, and tool surface (all pinned and hashed for replay). To get a model on the leaderboard, open an issue or PR on GitHub.